DIGITAL-JU-CHIPS-2026-SG-JAPAN – International collaboration EU and Japan on semiconductors

Identifikátor témy: DIGITAL-JU-CHIPS-2026-SG-JAPAN Výzva: DIGITAL-JU-CHIPS-2026-SG-JAPAN – DIGITAL-JU-CHIPS-2026-SG-JAPAN Program: Digital Europe Programme (DIGITAL) Časť programu: DIGITAL Typ akcie: DIGITAL-JU-SIMPLE DIGITAL JU Simple Grants Typ zmluvy (MGA): DIGITAL Action Grant Budget-Based Stav: Open Otvorenie: 7. 7. 2026 Termín(y) podania: 8. 12. 2026 Rozpočet: 5 000 000 € Predpokladaný počet grantov: 2 Minimálny príspevok EÚ na projekt: 3 000 000 € Maximálny príspevok EÚ na projekt: 5 000 000 €

Expected Outcome:

Projects are expected to contribute to the following expected outcomes:

- Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities. - Standardised chiplet interfaces, enabling interoperability and fostering a dynamic chiplet ecosystem

Expected outcomes should have direct and immediate impact on European industry.

Furthermore, proposed projects should demonstrate solutions across laboratory and pilot environments, with verification in semiconductor manufacturing use cases. The centre of gravity of envisaged work should address Technology Readiness Levels 5-7. Proposals also need to facilitate knowledge transfer and promote stakeholder engagement through industry workshops, publications, and networking events.

Conditions

1. Admissibility conditions: Proposal page limit and layout

described in Appendix 8 of Work Programme - Chips for Europe Initiative call document.

Proposal page limits and layout: described in Part B of the Application Form available in the Submission System.

2. Eligible countries

described in Appendix 8 of Work Programme - Chips for Europe Initiative.

3. Other eligibility conditions

Appendix 8 of Work Programme - Chips for Europe Initiative.

4. Financial and operational capacity and exclusion

described Appendix 8 of Work Programme - Chips for Europe Initiative.

5a. Evaluation and award: Submission and evaluation processes

described Appendix 8 of Work Programme - Chips for Europe Initiative and the Online Manual.

5b. Evaluation and award: Award criteria, scoring and thresholds

described Appendix 8 of Work Programme - Chips for Europe Initiative.

5c. Evaluation and award: Indicative timeline for evaluation and grant agreement

described in Appendix 8 of Work Programme - Chips for Europe Initiative.

6. Legal and financial set-up of the grants

described Appendix 8 of Work Programme - Chips for Europe Initiative.

Call Details

Call document and annexes:

Model Grant Agreements (MGA)

DEP MGA

Additional documents:

DEP Regulation 2021/964

EU Financial Regulation 2024/2509

EU Grants AGA — Annotated Model Grant Agreement

Funding & Tenders Portal Online Manual

Funding & Tenders Portal Terms and Conditions

Funding & Tenders Portal Privacy Statement

Aktuality k téme: - 2026-09-23: IMPORTANT UPDATE : Please note that the deadline for the DIGITAL-JU-Chips-2026-SG-JAPAN call has been postponed. The new deadline is now December 8th, 2026 (originally September 24th, 2026). - 2026-07-07: The submission session is now available for: DIGITAL-JU-CHIPS-2026-SG-JAPAN